OpTeC sponsors a colloquium throughout the academic year. This is a forum where a wide range of optical science and engineering topics are discussed at a level that can be understood by a broad spectrum of optics students, staff, and faculty. The primary purposes are to train students to give effective scientific talks and to promote cross-disciplinary interactions of students, staff, faculty, and local industry employees. Speakers include MSU students, staff, and faculty, and visitors from external universities, research labs, and companies.
Join our colloquium on
Thursday, November 30 at 4:10 pm.
Norm Asbjornson Hall, Room 165
Packaging Technologies of Integrated Photonics for Quantum Technology
Stefan Heinemann, Phix, North America
Quantum Technology is based on photonic packages that combine active semiconductors generating single-frequency radiation and photodetectors with photonic integrated circuits (PIC) for routing the photons and active components for modulating the photons. Typically, tens of individual single-mode channels must be precisely controlled for constant optical path length and sensitive, high-frequency feedback loops are deployed. Integrated photonic packages must be designed to properly manage the temperature distribution between passive and active optical elements and dissipate heat properly. The routing of electrical DC and RF drive currents, as well as sensitive RF sense currents, must be laid out for minimal interference. Consistent high optical coupling efficiency of all optical channels is vital for performance.
We will review the state of the art for design and execution of integrated photonic packages. Consistent, high-quality die and wire bonding is routinely performed at our facility. We will report on our technologies for high-efficiency optical coupling between semiconductors and fiber arrays (FAU) or photonic integrated circuits (PIC) that include butt coupling, integrated spot-size converters made by ion exchange, and nanoimprinted lenses that also enable surface coupling. We will also present our demonstrator made on an 8” wafer with more than 3,000 electrical connections.
Stefan Heinemann recently took the position of VP of Sales for Phix, North America. Phix US is currently established and will support customers in North America in their production and development of integrated photonic platforms. He joined from Aurora, the autonomous trucking company where he led the team for opto-mechanical engineering of the First Light Lidar product and the packaging efforts for next-generation Lidar on the Chip, both enabling coherent 4D detection up to 400 m. Before that, he managed the development of a high-power diode laser product line and the technology development team at TRUMPF Photonics, which is part of the TRUMPF Group, a worldwide operating provider of laser machine tools. Before his appointment at TRUMPF, he was the director at Fraunhofer USA, Center for Laser Technology, where he developed and commercialized novel production technologies with light serving academia, federal agencies, and industry. He started his professional career at JENOPTIK in Jena, Germany.
He co-founded four companies in lasers and renewable energy, holding positions as CEO and CTO. He initiated the alliance for Clean Transportation, a private-public partnership of the University of Michigan, Fraunhofer, and industry.
He earned a diploma in Physics from the Technical University of Munich and a Ph.D. in electrical engineering from the Technical University of Berlin. He holds 68 patents and has more than 150 published works.
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